Chamfering Wheel
It is a whetstone for the chamfering processing of the silicon wafer. I adopt metal bond to a binder and it is highly precise and realizes high efficiency processing. I cope with various specifications such as various shapes, a single groove and consecutive grooves, a fault, a finish one model.
Specifications and dimensions
Standard specifications
Abrasive
| Particle size
| Intensive degree
| Combination materials (bond)
| |
Standard
| Durability serious consideration
| |||
SD
| #400
...
♯2000
| 75
...
125
| MNK016
| MNK018
|
Stock size
Outer diameter
| Diamond layer width
| Diamond layer thickness
| Groove
|
102mm
...
202mm
| 3mm
...
5mm
| 3mm
...
15mm
| 1
...
10 grooves
|
Processing example
Particle size
| Wheel circumferential speed
| Aspect coarseness (Ra)
|
#800
| 2500m/min
| 0.3μm
|
#1500
| 2500m/min
| 0.15μm
|
Diamond layer shape type
※An available combination varies according to bond.
I may cope as well as the above. Specifically, please refer until our business.
I may change this catalogue without a notice.
