Laboratory of ingot circumference cut Wheel
◇ Grind a periphery; Wheel for the orientation flat side processing
The metal bond designed for silicon ingot processing has good wear resistance, balance of the blade action from the spontaneous generation, and a dress interval is long to continue stable-related ga to grind and realizes a total-like cost cut. In addition, it is highly precise, and finished tomen processes the ingot surface into a high flat degree.
Specifications and dimensions
Standard specifications
Particle size
| Intensive degree
| Combination materials (bond)
| |
Rough grinding cut
| Seiken cut
| ||
#60
...
#80
| ♯140
...
♯200
| 75
...
100
| Metal
|
External form
| Diamond layer width
| Diamond layer thickness
|
78mm - 120mm
| 6mm - 9mm
| 8mm - 10mm
|
Processing example
Process
| Particle size
| Aspect coarseness (Ra)
|
Rough grinding cut
| #80
| |
Seiken cut
| #140
| max 1.0 (ave 0.8)
|
I provide it by the specifications combination that I matched with the needs of the visitor, possession facilities together for rough grinding cut, the Seiken cut.
◇ Wheel for the notch processing
Know-how of the precision tininess processing cultivated for V-shaped processing of the Wheel for many years as reading sapuraya in Magnetic head, the optical component industry is kept alive, and, as for the dimensions precision of angle, tip R, the touch of a core, the aspect is small from the start, too, and high-precision V-groove processing is possible. In addition, restraint of eccentrically wearing it by the high Wheel precision and the bond superior in wear resistance realize the extension of life of the tool.
Specifications and dimensions
Particle size
| Intensive degree
| Bond
|
#120 - #270
| 100
| Metal
|
External form
| Angle
| Tip R
|
80mm - 120mm
| 90 degrees - 120 degrees
| 0.9 ... 1.0
|
※An available combination varies according to bond.
I may cope as well as the above. Specifically, please refer until our business.
I may change this catalogue without a notice.
