Cutting Blades
Dicing, Slicing, Grooving for
Silicon, Glass, Ceramic, Crystal and any other hard brittle materials.
Silicon, Glass, Ceramic, Crystal and any other hard brittle materials.
High prercision thin cutting blades has come to be used a lot to process precision electronic parts. The all blade type is for economical use and the hub type cutter is for thinner curf application. The optimum bond is selectionable from wide variety of bond such as metal, metal-resin and resin, and formed with sintering or electroforming process to meet with the requirment. ADAMAS cutting blades will show the excelent result to process any hard and brittle materials.such as altic for magnetic head, silicon, high precision optical glass, quartz and electro ceramic.
All Blade
| Grid size SD(#) |
Concent -ration C(%) |
Bond type MTB |
Outside Diameter OD(mm) |
Thickness T(mm) |
Inside Diameter H(mm) |
| 325 | 25 | -001 | 50 | 0.15 | |
| 400 | 50 | -003 | ～ | ||
| 600 | 75 | -004 | 56 | ～ | 40 |
| 1200 | 100 | -005 | ～ | ||
| 125 | -101 | 60 | 0.3 |
Other sizes are available. Please contact to our sales agent.
High Precision Cutter
Standard cutter size list
| C (mm) |
Out side diameter(mm) | ||||||||||||||
| 55 | 70 | 75 | 100 | 105 | 110 | 115 | 125 | 130 | 145 | 150 | 155 | 170 | 175 | 200 | |
| 0.100 |  |
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| 0.150 | |
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| 0.200 | |
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| 0.250 | |
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| 0.300 | |
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| 0.350 | |
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| 0.400 | |
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| 0.450 | |
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| 0.500 | |
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| 0.550 | |
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| 0.600 | |
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| 0.700 | |
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| 1.000 | |
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Metal bond cutter 
Resin bond cutterOther sizes are available. Please contact to our sales agent.
